| PART |
Description |
Maker |
| FBGA-SD |
Fine Pitch Ball Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| 1FGSXXXX |
Ball Grid Array Socketing System
|
Advanced Interconnections
|
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| BC-148 |
148-Lead Chip Scale Package Ball Grid Array
|
Analog Devices, Inc.
AD[Analog Devices]
|
| FL9B5BH030S-C FL9B5BH060S-C FL7B5BH FL9B5BH033S-C |
Ball-Grid-Array Thin Film Low-Pass Filter
|
ETC
List of Unclassifed Manufacturers
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm
FAN AC 80X25 220V BALL, 25cfm
FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五（巴西）总裁| 12A条一（c）|47VAR
|
EPCOS AG
|
| K4S51323PF-MF90 K4S51323PF-MF75 K4S51323PF-MF1L K4 |
16M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 LEAD FREE, FBGA-90
16M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 FBGA-90
16M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 LEAD FREE, FBGA-90
16M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 FBGA-90
4M x 32Bit x 4 Banks Mobile-SDRAM
From old datasheet system
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| PGM08XXX-XX PGM12XXX-XX |
IC Socket / Pin Grid Array
|
Aries Electronics
|
| CPGA |
Ceramic Pin Grid Array Package
|
Amkor Technology
|
| 546-99-108-12-101-036 546-91-108-12-101-035 546-91 |
Pin Grid Array sockets Press-fit terminations 针栅阵列插座压接端子
|
PRECI-DIP SA
PREDIP[Precid-Dip Durtal SA]
|
